Maxwell(R) SI Spicelink lets engineers evaluate high-speed circuit design issues involving electromagnetic and transmission line effects by evaluating physical performance of circuit structures at an IC, PCB, package, or system level. SI Spicelink computes an efficient equivalent circuit model for 2D transmission lines and 3D discontinuities that can be used in SPICE-based modeling of signal integrity, crosstalk, ground bounce, and propogation delay. SI Spicelink includes a Multi-layer Interconnect Modeler that automatically generates 3D structures from multi-layer planar structures in DXF or GDSII format for the Maxwell(R) 3D solvers.
Mark Ravenstahl
Sales Representative Ansoft Corporation 4 Station Square Suite 660 Pittsburgh, PA 15219-1119 USA 412-261-3200 fax:412-471-9427 howie@ansoft.com